JPH0430182B2 - - Google Patents

Info

Publication number
JPH0430182B2
JPH0430182B2 JP58093022A JP9302283A JPH0430182B2 JP H0430182 B2 JPH0430182 B2 JP H0430182B2 JP 58093022 A JP58093022 A JP 58093022A JP 9302283 A JP9302283 A JP 9302283A JP H0430182 B2 JPH0430182 B2 JP H0430182B2
Authority
JP
Japan
Prior art keywords
mold
cull
resin
recess
plunger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58093022A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59218736A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9302283A priority Critical patent/JPS59218736A/ja
Publication of JPS59218736A publication Critical patent/JPS59218736A/ja
Publication of JPH0430182B2 publication Critical patent/JPH0430182B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP9302283A 1983-05-26 1983-05-26 半導体樹脂封止装置 Granted JPS59218736A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9302283A JPS59218736A (ja) 1983-05-26 1983-05-26 半導体樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9302283A JPS59218736A (ja) 1983-05-26 1983-05-26 半導体樹脂封止装置

Publications (2)

Publication Number Publication Date
JPS59218736A JPS59218736A (ja) 1984-12-10
JPH0430182B2 true JPH0430182B2 (en]) 1992-05-21

Family

ID=14070856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9302283A Granted JPS59218736A (ja) 1983-05-26 1983-05-26 半導体樹脂封止装置

Country Status (1)

Country Link
JP (1) JPS59218736A (en])

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0657414B2 (ja) * 1988-06-27 1994-08-03 トーワ株式会社 電子部品の樹脂封止成形方法及び金型装置
JPH04147814A (ja) * 1990-10-11 1992-05-21 Daiichi Seiko Kk 樹脂封入成形用金型
US5698242A (en) * 1995-12-20 1997-12-16 General Instrument Corporation Of Delaware Apparatus for the injection molding of semiconductor elements
KR100521977B1 (ko) * 2000-10-17 2005-10-17 앰코 테크놀로지 코리아 주식회사 반도체 패키지 제조용 몰드블럭

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5197567U (en]) * 1975-02-03 1976-08-05

Also Published As

Publication number Publication date
JPS59218736A (ja) 1984-12-10

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